IEEE Transactions on Dielectrics and Electrical Insulation 论文模板(TDEI Template)

发布时间：2023-04-13 02:02:15

PreparationofPapersforPublicationinIEEETransactionsonDielectricsandElectricalInsulationAuthor(sSameAddressSheridanPrintingCo.1425ThirdAvenueAlpha,NJ08865,USAandOtherAuthor(sUniversityofKnowledgeDepartmentofFunCityofLeisure,PA18045,USAABSTRACTTheseinstructionsgiveyouguidelinesforpreparingpapersfortheIEEETRANSACTIONSONDIELECTRICSANDELECTRICALINSULATION.UsethisdocumentasatemplatewithMicrosoftWord6.0orlater.Defineallsymbolsusedintheabstract.Donotcitereferencesintheabstract.TheabstractbodycopyshouldbeinTimesorTimesNewRoman,10pt.Bold.IndexTerms—Instructions,guidelines,abstract,copy.AlistofacceptedIEEE/TDEIindextermsareavailableonthesubmissionpage.1INTRODUCTIONTHISdocumentisatemplateforMicrosoftWordversions6.0orlater.IfyouarereadingapaperorPDFversionofthisdocument,pleasedownloadtheelectronictemplatefromhttp://www.cloznet.com/ieeetdei/TDEI%20Template.doctoprepareyourmanuscript.TheobjectiveofthisdocumentistoprovideatemplateforthepreparationofapaperforpublicationintheIEEETRANSACTIONSONDIELECTRICSANDELECTRICALINSULATION.TheuseofthistemplatewillensuretheprofessionalappearanceofyourpaperaswellasprovidingauniformdigitalsourcefromwhichtosatisfytheelectronicpublicationrequirementsofIEEEXplore.Whenyouopenthisdocument,select“PageLayout”or“PrintLayout”fromthe“View”menuinthemenubar,whichallowsyoutoseethefootnotes.Thentypeoversectionsofthisdocumentorcutfromanotherdocumentandpasteandthenusemarkupstyles.Thepull-downstylemenuisattheleftoftheFormattingToolbaratthetopofyourWordwindow(forexample,thestyleatthispointinthedocumentis“Text”.Highlightasectionthatyouwanttodesignatewithacertainstyle,thenselecttheappropriatenameonthestylemenu.Thestylewilladjustyourfontsandlinespacing.Donotchangethefontsizesorlinespacingtosqueezemoretextintoalimitednumberofpages.Useitalicsforemphasis;donotunderline.Turnoff“smartquotes”(Tools|AutoCorrect|AutoFormattabs.Turnoffautomatichyphenation(Tools|Language|Hyphenation.ManuscriptreceivedonXMonth2005,infinalformXXMonth2005.ToinsertimagesinWord,positionthecursorattheinsertionpointandeitheruseInsert|Picture|FromFileorcopytheimagetotheWindowsclipboardandthenEdit|PasteSpecial|Picture(with“Floatovertext”unchecked.2PROCEDUREFORPAPERSUBMISSIONThissectioncoversthedetailsregardingpreparationofyourmanuscriptforsubmission,thesubmissionprocedure,reviewprocessandcopyrightinformation.2.1PREPARATIONOFMANUSCRIPTIntheinterestofspeedandeconomy,theIEEETRANSACTIONSONDIELECTRICSANDELECTRICALINSULATIONisprinteddirectlyfromthiselectronictemplateasfurnishedbytheauthorafterathoroughpeerreview.Sincethefinalprintedpagesarebasedonthesubmittedcopy,weurgethatutmostcarebetakeninthepreparationutilizingthiselectronictemplate.Foryourinformation,pagesizeis8.5x11inchesandcolumnwidthis3.5inches(8.9mmandcolumnlength9.2inches(23.4cm.Allfiguresandtablesshouldhaveadequatetitlesorcaptions,andmustbeintegrallyplacedattheirproperlocation(sinthetext.Forthebenefitofthereaders,thefigures,tables,graphsandphotosshouldbeplacednearthecorrespondingtext;thatis,notaccumulatedattheendofthetextorattheendofthemanuscript.FurtherinformationonFiguresandTablescanbefoundinSection6.1.Duecareshouldbeexercisedtoavoidtheuseofabbreviationsandphraseswhichmaynotbefamiliartoallreaders.ReadersoftheIEEETRANSACTIONSONDIELECTRICS
ANDELECTRICALINSULATIONhavewideanddiversebackgroundsandmaynotbeemployedinthespecificareaofanygivenpaper,butarestillinterestedinfollowingthestate-of-the-art.Allabbreviationsandphrasesneedtobesuitablydefinedinthetext.Thelengthoftechnicalpapers,ingeneral,ispreferredtobenotmorethan8pages(includingallfiguresandbiographies.Reviewtypepapersmaybelonger.Thisrequirementisunfortunatelydictatedbyfinancialconstraints.Theeffortsofthepersonswhootherwiseprovidedhelptotheauthor(sshouldberecognizedintheAcknowledgmentsectionattheendofthepaper.Foreachauthor,werequireaphotographofheadandshoulder(24mmx30mmandabrieftechnicalbiography.BeginwiththeauthornamefollowedbyIEEEmembershipgrade(s(e.g.S‟91-M‟95-SM‟00-F‟05.Continuewiththedateandplaceofbirth,educationalbackground,degreesreceived,yearreceivedanduniversitiesnamesandtheirlocations,employmenthistoryandspecialfieldsofinterest.2.2SUBMISSIONPROCEDURETheTransactionsEditorwillneedtoreceiveanelectronicversionofyourmanuscript.TheonlyacceptableelectronicformatisWord6.0orlater(.doc.Papersmustbesubmittedelectronicallytothefollowingwebsite:http://www.cloznet.com/ieeetdei..Thewebsitewillrequireyoutoenterinformationaboutthepaperaswellascontactinformation.UponsuccessfulsubmissionofthepaperanemailconfirmationwillbesenttothecorrespondingauthoracknowledgingthereceiptofthepaperandotherinformationincludingthenameoftheAssociate/GuestEditorwhoishandlingthereview.Iftherearequestions,thecorrespondingauthormaywishtocontact:ProfessorReubenHackamEditor-in-Chief,IEEETDEI725NorthTalbotRoadWindsor,OntarioN9G1M8,CanadaTel.:519-966-4748hackam@uwindsor.caorr.hackam@ieee.org2.3REVIEWPROCESSAllpaperssubmittedtotheIEEETRANSACTIONSONDIELECTRICSANDELECTRICALINSULATIONaresubjecttoathoroughreviewprocess.TheEditor-in-ChiefisresponsibleforcoordinatingthereviewamongmembersoftheEditorialBoardandmakingfinaldecisionsonthepapersubjecttotherecommendationoftheAssociate/GuestEditorhandlingthepaper.RoutineinquiriesastothestatusofthesubmittedpaperwithintheReviewprocesscannotbeaccommodated.2.4COPYRIGHTItisthepolicyoftheIEEEtoownthecopyrighttothetechnicalcontributionsthatitpublishesonbehalfoftheinterestsoftheIEEE,itsauthors,andtheiremployers,andtofacilitatetheappropriatere-useofthismaterialbyothers.TocomplywiththeU.S.copyrightlaw,authorsarerequiredtosignanIEEECopyrightFormbeforepublication.Thisformreturnstoauthors,andtheiremployers,fullrightstoreusetheirmaterialfortheirownpurposes.Authorsmustsubmitasignedcopyofthisformwiththeirmanuscriptsonlineduringthesubmissionofthepaper.Theformwillbegeneratedduringtheelectronicsubmissionprocess.3EDITORIALPOLICIESTheIEEEDielectricsandElectricalInsulationSociety(DEISisresponsibleforleadership,coordination,andcommunicationamongthosewhoareconcernedwithdielectricphenomenaandmeasurements;withdevelopmentandcharacterizationofgaseous,liquid,andsolidelectricalinsulatingmaterialsandvacuum;andwithutilizationofthesematerialsincircuitsandsystemsunderconditionsofuse.TheSocietyofferstwopublicationswhicharerelevanttothedisseminationofinformationwithinitsscope:theseTransactionsonDielectricsandElectricalInsulationandtheElectricalInsulationMagazine.Ineachpublication,everypaperisreviewedandevaluatedforacceptabilityintermsofitsrelevance,itstechnicalcontribution,and,fortheTransactionsonDielectricsandElectricalInsulationitscontinuingvalueaspartofthepermanentliterature.Reportsandarticlesworthwritingdeserveskillfulpresentation.Thetextmustbestylisticallyandgrammaticallycorrect.Thefactsandideasneedtobeexpressedclearly,succinctly,andattractivelyfortheaveragereader;theauthorshouldnotassumethateveryreaderisanexpertintheauthor‟sfield.Stimulatingandinformativecommunicationofscientificandtechnicalknowledgethathascontinuingvalueisrequired.Goodstyleandclarityarecourtesiesthattheauthorowestothereader.Thepurposeofpublicationistoconveytechnicalinformation.Goodwritingensuresthatthisisaccomplished.TheauthorneedsnotbeamemberoftheIEEEoroftheDEIS.Allpersonsactiveinthefieldareencouragedtosubmitpapersforconsideration,irrespectiveofprofessionalaffiliation.Anessentialpartofresearchisopenpublicationofitsresults.Therefore,itcanbearguedthataresearchprojectshouldbearpartofthepublicationcost,usuallypaidintheformofpagecharges.Nevertheless,theDEIScurrentlydoesnotlevypagecharges.AllpublicationcostsarepaidbytheDEISasaservicetoitsmembersandtheresearchcommunity.However,ifeitherthefigures,tablesorotherartworkinthemanuscriptviolatetheguidelines,orifchangesaremadeonthefinalproofbeyondtheoriginalmanuscript,theauthorwillbechargedappropriatemodificationcosts.

IEEE Transactions on Dielectrics and Electrical Insulation 论文模板(TDEI Template)

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